 |
 |
|
|
|
Mr. Dean Klein
VP of Memory System Development
Micron Technology
|
|
|
Profile: |
||
|
|
||
|
Education:
Master of Electrical Engineering from the University of Minnesota
|
||
|
|
||
|
Experience:
Fourteen years with Micron Technology
Current focus on developing memory technologies and capabilities
Co-founder and former President of PC Tech, Inc.
Over 220 patents in computer architecture and electrical engineering
|
||
| Abstract: | ||
| 3D IC Memory Opportunity: HMC | ||
|
|
||
|
3D integration poses many technical challenges to the IC design and manufacturing community, but the rewards can be huge. The Hybrid Memory Cube, or HMC, is a memory solution which incorporates 3D packaging to reap tremendous benefits in power and performance. In this talk, the technology behind the HMC and its benefits are explored as well as the opportunities for HMC in system solutions. Several system architecture options are also presented and explored.
|
||
