


	Mr Mark Beesley Chief Operating Officer, Advanced Packaging AT&S AG

Profile

Education: Mechanical Engineering BEng (Hons)

Experience: Leads team responsible for AT&S ECP technology Previously headed AT&S R&D Group Experienced Business Executive
Abstract:

Embedded Component in Panel Production

Embedded Component Packaging has entered in to the mass production phase for packaging applications in the smartphone and tablet segment. Combining the benefits of significant miniaturization and performance advantages, embedded component has additional attraction as the initial assembly operation is processed in large, panel level production formats. This paper outlines the current status of leading companies in the production of embedded component substrates, the relative benefits of those technologies, and the applications where embedded component is expected to take a firm market hold.