The giga-trends of mobile computing, converged devices, cloud, and many other emerging applications will continue to drive the growth of the semiconductor and electronics industry. System scaling through chip scaling (i.e., Moore's law) and heterogeneous 3D die stacking is key to the ultimate energy-efficient system integration into the 2020s. Collaborative open innovation is necessary to overcome many of the technical challenges and capture the business opportunities ahead. The dedicated foundry industry segment is in a unique position to foster this innovation model and deal with the design, EDA, IP, and manufacturing challenges of system scaling because it supports a broad range of applications and a diverse customer base. The TSMC Open Innovation Platform (OIP) is a good example of what will be required in the future. OIP is a thriving symbiotic ecosystem that features the semiconductor industry's largest combined R&D investment and innovative power capable of concurrent design and process co-optimization. The Grand Alliance among TSMC, its customers, suppliers and its ecosystem partners would enable the collective business success in the new mobile era.




	Dr. Jack Sun / 孫元成 VP of R&D, CTO TSMC, IEEE Fellow

Profile

Education :
Ph.D. Electrical Engineering, University of Illinois

Experiences :
Senior Director, LTD, TSMC R&D R&D Management, IBM Research

Abstract:

Collaborative Innovation in the New Mobile Era

The giga-trends of mobile computing, converged devices, cloud, and many other emerging applications will continue to drive the growth of the semiconductor and electronics industry. System scaling through chip scaling (i.e., Moore's law) and heterogeneous 3D die stacking is key to the ultimate energy-efficient system integration into the 2020s. Collaborative open innovation is necessary to overcome many of the technical challenges and capture the business opportunities ahead. The dedicated foundry industry segment is in a unique position to foster this innovation model and deal with the design, EDA, IP, and manufacturing challenges of system scaling because it supports a broad range of applications and a diverse customer base. The TSMC Open Innovation Platform (OIP) is a good example of what will be required in the future. OIP is a thriving symbiotic ecosystem that features the semiconductor industry's largest combined R&D investment and innovative power capable of concurrent design and process co-optimization. The Grand Alliance among TSMC, its customers, suppliers and its ecosystem partners would enable the collective business success in the new mobile era.