As we know the mobile technology has been an impetus to the semiconductor market. Seeing advanced Si nodes developed according to mobile processors the interaction between chips and packages has ever been put emphasis on. Thin packaging solution is requried in smartphone market and also the memory bandwidth is a key subject matter in the next generation application processors as well.. In addittion, applications such as power management and sensors related are driving wafer level solution. In this talk packaging technoloties dealing with the cost, smartphone requirements,and high end 3D IC. In particular, 2.5D (interposer) related packaging involves the fab like processes and the challenges and progress on this subject will be discussed.




	Dr. Choon Heung Lee Corporate Vice President, Business & Technology Amkor Technology

Profile

Education :
Masters and Ph.D. in Physics, Case Western Reserve Univ.

Experiences :
18 years RnD at Amkor Working on simulation, design, package development such as 1 metal layer, TMV, TSV, WLFO WLP, Mems etc. Coporate Procurement

Abstract:

From Advanced Package to 2.5D/3D IC

As we know the mobile technology has been an impetus to the semiconductor market. Seeing advanced Si nodes developed according to mobile processors the interaction between chips and packages has ever been put emphasis on. Thin packaging solution is requried in smartphone market and also the memory bandwidth is a key subject matter in the next generation application processors as well.. In addittion, applications such as power management and sensors related are driving wafer level solution. In this talk packaging technoloties dealing with the cost, smartphone requirements,and high end 3D IC. In particular, 2.5D (interposer) related packaging involves the fab like processes and the challenges and progress on this subject will be discussed.