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Ms. Rozalia Beica
CTO & Business Unit Director
Yole Développement
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Profile: |
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Rozalia Beica is the CTO and Business Unit Director leading Advanced/3D Packaging and Semiconductor Manufacturing activities within Yole Developpement. For more than 15 years she has been involved in the research, strategic marketing and application of WLP and 3D/TSV at materials (Rohm and Haas), equipment (Semitool, Applied Materials, Lam Research) and device manufacturing (Maxim IC) organizations.
Rozalia has authored over 50 papers and publications and she is actively participating in several 3D & Advanced Packaging Committees worldwide.
Rozalia has a M.Sc in Chemical Engineering (Romania), a M. Sc. In Management of Technology (USA) and a Global Executive MBA from IE Business School (Spain).
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| Abstract: | ||
| Market Overview - Extension Embedded Technology to Wider Application | ||
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Embedded technologies (FOWLP and die) are unique technological breakthroughs enabling further growth of next-generation packaging modules. They bring several benefits such as miniaturization, electrical and thermal performance improvement, cost reduction and simplification of logistic for OEMs.
If the first generation of embedded die and FOWLP technologies as well as the necessary infrastructures to support them are now clearly settled and proven in high volume manufacturing, targeting different applications, in the years to come, we are expecting to witness a fascinating battle in the 3D Packaging space with embedded die packaging technologies being supported by large-panel PCB infrastructure, and FOWLP technologies moving to larger substrates (wafers and panels), mixing PCB, semiconductor back-end, semiconductor WLP and LCD large area processing know-how.
It is a real opportunity for semiconductor chip manufacturers, substrate suppliers and IC packaging & test companies to work together to consolidate and strengthen the system value-chain, bringing more complex, higher added- value modules by integrated multiple chips, passives and IC substrates together.
In this talk, Yole Développement will look at the current status of the 3D Packaging industry, provide recent forecasts and overview of IP activities as well as discuss further evolution of embedded packaging technologies.
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