


	Mr. Markus Wimplinger Corporate Technology Development. & IP Director EV Group

Profile

Responsibilities: •In charge of EVG process engineering worldwide •Management of R&D partnerships, contracts with 3rd party organizations, IP affairs •2002 – 2006: Technology Director of EVG North America •Educational background: HTL Braunau, Austria – Electrical Engineering


Trends in Wafer Bonging for High Volume Consumer MEMS Applications

Abstract

Wafer bonding is now a well known process step in the manufacture of MEMS devices. However, the processes and equipment used for wafer bonding are undergoing significant changes. There are two primary forces driving these changes in the wafer level bonding of MEMS. The first force is the strong year on year growth in MEMS revenue which is primarily driven by the adaptation of MEMS devices, such as accelerometers, gyroscopes, magnetometers, microphones and pressure sensors. This growth and the competition in the consumer MEMS market segment has put substantial pressure on cost reduction and the volumes have driven substantial process improvement. The second driving force is increasing requirements on wafer bonding from product performance requirements such as encapsultated vacuum for gyroscope or conductive bond interfaces for heterogeneous integration. This presentation will review the trends in wafer bonding for MEMS that are addressing the cost and performance issue driven by high volume consumer MEMS.