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Dr. Kuo-Ning Chiang / 江國寧

Distinguished Professor, Dept. of Power Mechanical Engineering 

National Tsing Hua University
 
 

Profile
 
Professor Chiang of National Tsing Hua University has published more than 250 technical papers in international journals and conference proceedings (68 of them are listed in IEEE Explore) and he own 31 Taiwan patents, 8 US patents, 1 Mainland China’s patent and 1 Singapore patent. Professor Chiang was the associate editor of 4 SCI Journals, IEEE Transactions, Components and Packaging Technologies as well as Advanced Packaging, ASME Transactions – Journal of Electronic Packaging and Journal of Mechanics, currently he is the Co-Editor-in-Chief of IEEE Transactions on Components, Packaging and Manufacturing Technologies. His vision and research performance drives to establish a “Design on Simulation (DOS)” based development procedure for advanced packaging products such as WLCSP and 3D packages, he is a well-known scholar in this research and application field. Professor Chiang has collaborated with many electronic packaging house, semiconductor and LED companies such as ACET, TSMC, UMC, EPISTAR (LED), VIA, etc. Currently, professor Chiang is the Chairman of Taiwan Microelectronics and Packaging Society and also President of IMAPS - Taiwan. He also serves as the director of National Center for High-Performance Computing, the director of Advanced Packaging Research Center of National Tsing Hua University.