


	Dr. Dyi Chung Hu / 胡迪群 Senior Vice President, R&D and New Business Development Unimicron Technology Crop.

Profile

Education: Ph. D. in Material Science and Engineering Department, Massachusetts Institute of Technology,USA
Experience: Senior Vice President, RD and New Business Development, Unimicron Co-founder, PVI and HSD Display. IBM / East Fishkill, Electronic Packaging Development Assistant Professor, NCTU
Abstract:

Panel Level Embedded Technology

Embedded Technology gains popularity by achieving better electrical performance and small form factor of packages. This is an important technology especially for packages used in mobile devices. Compare to FO-WLP, panel level packaging PLP has the advantage of using large panel (≧20”) processing compare with FO-WLP while 12” is commonly used. Hence PLP has a better cost down potential than FO-WLP. In this talk, comparison both FO-WLP and PLP technology is presented. Industry has developed panel level packaging technology; copper trace, passive components such as capacitors, resistors, inductors and IPDs can be embedded into substrate. Active components can also be embedded into substrate by PLP technology. Beside above, at Unimicron we also developing technology to embed interposer into substrate. It’s merit will be presented in this talk. In the future, many components and devices can be embedded into the substrate and connected to each other to achieve the goal of better performance and smallfrom factor. PLP technology is the key enable technology for system integration.