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Mr. Takashi Kariya

Division Manager, R&D Operation, Electronics Development Division

IBIDEN
   

Profile

  
   
-Education:
Nagoya Institute of technology 		 
   
-Job Experience:
Managing R&D division more than 5 years in Ibiden for advanced FCPKG substrate / FCCSP substrate / Printed Wiring Board / 2.5D-3D SiP / Embedded Passive and Active. 		  
   
Abstract:  
   

Expectation of Embedded Device Technology and Key Challenging Area.

  

 

  
In recent years, the embedded active/passive technology is widely attracted for down-sizing mobile products and improving its electrical performance. The package substrate using the technology is now in volume production level, and applied for the advanced mobile product. In this study, the representative embedded substrate technologies are presented by introducing our three developed technologies using the robust structure of the plating connection to satisfy the reliability requirement from our customers.

The three embedded substrate technologies are; 
(1) Embedded thinner MLCC in FC-CSP for higher clock frequency and lower power consumption
(2) Embedded Thin Film Capacitor in FC-PKG for high power delivery performance of server application
(3) Embedded active device technology to minimize body size that contribute to control the body warpage by maximizing silicon / body area ratio.

For more market expansion of the embedded substrate, we need the improvements for the following three points of view.
1. Technical point: We need to improve the process yield of the embedded substrate manufacturing especially for active device embedded. The embedded substrate routing design correlates to the signal I/O count of the active device. The routing design has to be optimized for minimizing the yield loss by the compensation of active device to be embedded.
2. Cost point: We need more cost saving solution. The embedded substrate cost need to be minimized by optimizing the balance of embedded device area in the substrate, since the no embedded device area is counted the same process cost as the embedded area.
3. Business model point: The business model has to be established for that both substrate and embedded device supplier can agree. The substrate supplier needs embedded device supplier to guarantee the device quality, also needs testing information from embedded device supplier for the sufficient product yield. The collaboration work between substrate supplier and embedded device supplier is essential for the embedded device design and testing especially for establishing the business model.