SEMI Taiwan Homepage
   
   

Mr. Brandon Wang / 王秉達

Director, 3D-IC Solution 

Silicon Realization Group, Cadence Design Systems





 

 

Profile


-Education:

MBA, University of Pennsylvania, USA
MSEE, New Jersey Institute of Technology
 
-Job Experience: 

Prior to Cadence, Brandon spent over 6 years at ARM, managing  the Interface IP Group, while also serving as a member of the Corporate Patent Review Committee, responsible for low power and high speed circuits. Before that, Brandon managed an engineering group at UBICOM, now part of Qualcomm. Brandon holds 6 US patents, and has published at a number of IEEE conferences/journal papers. He also serves as a board director for CASPA, a global Chinese semiconductor organization.          


Abstract:
 
 
 
A Holistic Method for 3D-IC Realization 
 
As Silicon Interposer Based 2.5D technology gearing up for production, EDA methodology becomes a critical enablement to reduce the  implementation cycle and improve design consistency and production yield. Unlike the silicon process scaling, which impacts mainly the ASIC/SOC digital implementation at those leading advanced nodes, 3D/2.5D technology will be used in intergating various applications from digital, analog, mixed-signal, memory, to image sensors, and MEMs. Therefore it requires wide range of EDA tools equiped with 3D/2/5D capability, from system/package to silicon implementation, from implementation, testability, to analysis. And all of them need to be working together seemlessly. This talk presents a holistic approach in realizing 2.5D system. The methodoloy features a flexibiity of multiple platform entries, totality of the 2.5D impact analysis, and integrated implementation and analysis capability.