


	Dr. Beth Keser Senior Staff Manager, Package Engineering Qualcomm Technologies, Inc.

Profile
Education: -Ph. D. Materials Science and Engineering, University of Illinois at Urbana Champaign
Experience: - >15 years experience in semiconductor industry with8 patents and >35 publications - IEEE CPMT ECTC’13 Program Chair - R&D Manager at Freescale and Motorola
Abstract

Applications of Fan-Out Wafer Level Packaging