


	Dr. Christopher J. Progler Chief Technology Officer Photronics Inc.

Profile

-Education Ph.D. Electrical Engineering, University of Texas, 1997


-Experience CTO and VP Strategic planning, Photronics Inc. Lithography Mgr at IBM, STM, TI Fellow SPIE

Abstract:

Trends Shaping Future Photomask Technology

Since the late 1990‘s with onset of the 130 nm node and sub-wavelength lithography, photomask technology has played an increasingly critical role in advanced integrated circuit patterning. Finer geometries coupled to more powerful lithography resolution enhancement techniques have required a system level approach to wafer patterning where photomask, software, exposing tool, resist and etching sub-modules become fully integrated parts of a complex image transfer process. As we stand on the edge of an industry wide multi-patterning extension cycle, the total lithography system again steps up in complexity as new interdependencies emerge between these critical patterning sub-modules. Considerations for implementing a capable, extendible and cost effective mask strategy in the multi-patterning era will be addressed with emphasis on how different end applications drive various technology and integration opportunities. We will also evaluate certain future trends in the IC industry with purpose to understand how these trends might impact the ongoing development and use of photomasks as a key enabler of IC delivery. Linkages between photomask quality and other parts of the patterning process will be highlighted and the need to drive for not only critical specification capability but also highly productive and reliable photomask solutions that maximize the ongoing design output of the wafer fab will be discussed.