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Mr. Tetsuya Okuno / 奥野 哲也

Senior Counselor, GM

Senju Metal Industry CO., LTD.
 

Profile
 

-Experience

Senior Councilor and GM, Solder technical center of Senju (Apr. 2012 ~)
President & CEO (2008~2012), Senju Comtek Corp. California USA (15 years in USA)
R&D senior stuff, Senju Metal Industry Co.,LTD (~ 1997)
Papers at ECTC 1999 and 2001
Papers at SMTA
30 years experience at Solder and soldering R&D and technical mentor. 

  
   
Abstract :  
   

Solder Material Technology for Embedded Package

 
High density packaging of semiconductor has been evolving in recent years. Packaging technology, such as 2.5D, 3D and embedded package is being developed by semiconductors industry.

As solder and joint materials for semiconductor packaging, micro-size solder ball and solder paste with fine powder are generally used for wafer or substrate bumping.

However, new solder materials and joint technologies are desired for 2.5D, 3D and embedded packaging.

Some key words are “finer pitch”, “higher reliability”, “thinner package”, “compatibility with UF” and etc.
As recent solder and the joint technology, “joint-protect flux/solder paste which strengthen joint reliability”, “new metallurgy micro size ball for controlling space height”, “new bumping technologies”, ”Silver paste” and others are recently introduced for 2.5D, 3D and embedded packaging.