Dr. David W. Wang joined ChipMOS in 2007 as Vice President, Research and Strategy Development Center, ChipMOS TECHNOLOGIES, INC. one of the leading back-end assembly and test service providers for advanced memories, LCD driver semiconductors, and mixed-signal products. He is also a member of the board.

Prior to ChipMOS, he was Vice President of Fibera, Inc. a Silicon Valley startup. He served as Senior Director at Lam Research where his responsibilities included 300mm new product introduction, system integration, automation, field escalation and management of regional teams. David also worked for IBM’s Microelectronics Division for 13 years at facilities located in Endicott and East Fishkill, New York where he as Senior Engineer / Manager led advanced packaging materials/process development and marketing organizations.

He was Chairman of the Board and President of Chinese American Semiconductor Professional Association (CASPA) from 2003 to 2004 and presently is a member of International Advisors. David received his Ph.D. / M.S. from the University of Michigan and B.S. from Fu Jen University. He is a member of Phi Lambda Upsilon and holds 40 U.S. patents.




	Dr. David Wang / 王偉博士 Vice President ChipMos

Profile

Dr. David W. Wang joined ChipMOS in 2007 as Vice President, Research and Strategy Development Center, ChipMOS TECHNOLOGIES, INC. one of the leading back-end assembly and test service providers for advanced memories, LCD driver semiconductors, and mixed-signal products. He is also a member of the board. Prior to ChipMOS, he was Vice President of Fibera, Inc. a Silicon Valley startup. He served as Senior Director at Lam Research where his responsibilities included 300mm new product introduction, system integration, automation, field escalation and management of regional teams. David also worked for IBM’s Microelectronics Division for 13 years at facilities located in Endicott and East Fishkill, New York where he as Senior Engineer / Manager led advanced packaging materials/process development and marketing organizations. He was Chairman of the Board and President of Chinese American Semiconductor Professional Association (CASPA) from 2003 to 2004 and presently is a member of International Advisors. David received his Ph.D. / M.S. from the University of Michigan and B.S. from Fu Jen University. He is a member of Phi Lambda Upsilon and holds 40 U.S. patents.