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SEMICON Taiwan 2012
   
   

Dr. Keh-Ching Huang

 

Dr. Keh-Ching Huang

 

Director, Corporate Marketing

 

UMC

 

Profile

 
His current responsibilities include Technical Marketing for logic and specialty processes, Applications Analysis, IP Planning, and Corporate Communications. Before UMC, he headed or held several marketing and RD positions in Global Unichip Corp., Faraday Technology, TSMC and Mosel-Vitelic. He has built up extensive knowledge in IC/semiconductor supply chain, business model and IP ecosystem through the years of service in the industry. Dr. Keh-Ching Huang received his PhD in EE from Purdue University and B. Sc in Physics from National Tsing Hua University, respectively.
   
   

Foundry TSV Enablement For 2.5D/3D Chip Stacking


 

Abstract

 
Although manufactured leveraging existing CMOS process technologies and tools, foundry TSV is considered new to high volume production practice due to its size, aspect ratio, and the effects induced in-die and across wafer. This presentation reviews the application background, the technical challenge and solution of foundry TSV, and how it links to an ecosystem work flow.