Mr. Vincent Tong
Senior Vice President
Xilinx Inc
Profile
- Worldwide Quality & New Product Introductions, APac Executive Leader
- 20+ years at Xilinx
- Responsibility for quality assurance for All Programmable FPGAs, SoCs & 3D ICs
- Chartered with business development & expansion in the APac region
- Manages advanced technology partnerships
- BS, Eng. & Computer Science, UC Berkeley, Stanford Business School, Executive Development Program
- 7 U.S. Patents
The Evolution of 3D ICs: Leaping Ahead of Moore’s Law to Deliver a 6.8B Transistor Device
Abstract
Xilinx, Inc. Senior Vice President, Vincent Tong’s talk will focus on the evolution 3D ICs, comparative approaches by industry pioneers, and a 28nm 3D IC case study of the world’s highest capacity FPGA and first heterogeneous 3D FPGA , both built using Xilinx’s revolutionary stacked silicon interconnect (SSI) technology. The case study will cover technology, applications and power benefits. It will conclude with a 3D standards call to action for our industry.