The challenges and opportunities in the CIS industry continue to evolve and more than ever packaging is at the crossroads of enabling or hindering Si solutions. To ensure that packaging is an enabling technology it will take a concerted effort on the part of the 3D CIS Supply Chain to make it a reality. The material presented will touch on the drivers and considerations to be taken into account in realizing these solutions.




	Mr. Derek Hinkle Sr. Director of Advanced Packaging Aptina Imaging, LLC

Profile

Sr. Director of Advanced Packaging; Aptina, LLC Director of Operations; Aptina, LLC Assembly Engineering Manager; Micron Technology, Inc. Speaker at SEMI-Singapore 2.5D/3D IC Forum


CMOS Image Sensors and 3D Integration

Abstract

The challenges and opportunities in the CIS industry continue to evolve and more than ever packaging is at the crossroads of enabling or hindering Si solutions. To ensure that packaging is an enabling technology it will take a concerted effort on the part of the 3D CIS Supply Chain to make it a reality. The material presented will touch on the drivers and considerations to be taken into account in realizing these solutions.