Dr. Ho-Ming Tong

Dr. Ho-Ming Tong / 唐和明博士

General Manager & Chief R&D Officer,
ASE Group

Chairman, SEMI Taiwan PKG&TEST

Committee

Profile

Dr. Ho-Ming Tong is presently Chief R&D Officer & General Manager of Group R&D, ASE Group and Advisory Committee Member of National Chip Implementation Center, National Applied Research Laboratories, Republic of China (Taiwan). Prior to joining the ASE Group, Dr. Tong served 13.5 years at IBM as Research Staff Member at Thomas J. Watson Research Center , and as Senior Engineering Manager at IBM’s East Fishkill Facility responsible for leading-edge IC and package development covering C4 plating and the plated copper wiring IC technology.

Dr. Tong was elected IEEE Fellow for leadership in leading-edge integrated circuits technology and also Fellow of the Chinese Society for Management of Technology. Among the awards Dr. Tong received were (1) the Electronics Manufacturing Technology Award from IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, (2) the John A. Wagnon Technical Achievements Award from The International Microelectronics And Packaging Society, (3) IBM Watson Research Division Award, (4) IBM Master Inventor, (5) the R&D Management Innovation Award from the Ministry of Economic Affairs, Republic of China, (6) the Outstanding Research Award of Pan Wen Yuan Foundation and (7) seven IBM invention plateau awards.

Dr. Tong received his Ph.D. degree from Columbia University in chemical engineering. He has authored/co-authored 112 patents, 100+ technical publications, as well as 2 books and 2 special journal issues on electronic packaging.




	Dr. Ho-Ming Tong / 唐和明博士 General Manager & Chief R&D Officer, ASE Group Chairman, SEMI Taiwan PKG&TEST Committee

Profile

Dr. Ho-Ming Tong is presently Chief R&D Officer & General Manager of Group R&D, ASE Group and Advisory Committee Member of National Chip Implementation Center, National Applied Research Laboratories, Republic of China (Taiwan). Prior to joining the ASE Group, Dr. Tong served 13.5 years at IBM as Research Staff Member at Thomas J. Watson Research Center , and as Senior Engineering Manager at IBM’s East Fishkill Facility responsible for leading-edge IC and package development covering C4 plating and the plated copper wiring IC technology. Dr. Tong was elected IEEE Fellow for leadership in leading-edge integrated circuits technology and also Fellow of the Chinese Society for Management of Technology. Among the awards Dr. Tong received were (1) the Electronics Manufacturing Technology Award from IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, (2) the John A. Wagnon Technical Achievements Award from The International Microelectronics And Packaging Society, (3) IBM Watson Research Division Award, (4) IBM Master Inventor, (5) the R&D Management Innovation Award from the Ministry of Economic Affairs, Republic of China, (6) the Outstanding Research Award of Pan Wen Yuan Foundation and (7) seven IBM invention plateau awards. Dr. Tong received his Ph.D. degree from Columbia University in chemical engineering. He has authored/co-authored 112 patents, 100+ technical publications, as well as 2 books and 2 special journal issues on electronic packaging.