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SEMICON Taiwan 2012
   
   

Mr. Min Yoo

 

Mr. Min Yoo / 柳敏

 

Sr. Director of R&D Division

 

Amkor Technology Taiwan
 

Profile
 
  • Sr. Researcher, TSV & Cu Pillar Development Division, Amkor Technology Korea
  • Co-Arthur, Next Generation Cu Pillar Technology, ECTC 2011
  • Co-Arthur, Key Elements of 3D Packaging using TSV Technology, International 3D SIC 2008 Tokyo
  • Co-Arthur, Review of Interconnection Process for TSV 3D Integrated Packages, UKC 2008
  • Owned  several US patents on electronic packaging
   
   

3D IC technology – OSAT perspective
 

Abstract
 
The value of supply chain for 3D IC Integration is open to all players, which are IDMs, Fabless, Foundries and OSATs. It’s obvious that 3D IC core value is moving to mid-end processes and final packaging. With the goal of high volume efficient and low cost production, many challenges exist today. In this session, various challenges and solutions at OSAT perspective will be reviewed.